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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant...
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Résumé
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in micro electronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for 130 nm technology node and beyond. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Sommaire
Overview on Low dielectric constant materials for IC applications
Materials Issues and characterization of Low-k dielectric materials
Structure and property characterization of Low-k dielectric porous thin films determined by X-ray reflectivity and small-angle neutron scattering
Vapor deposition of Low-k polymeric dielectrics
Plasma-enhanced chemical vapor deposition of FSG and a-C:F low-k materials
Porous organosilicates for on-chip applications: dielectric generational extendibility by the introduction
Metal/polymer interfacial interactions
Diffusion of metals in polymers and during metal/polymer interface formation
Plasma etching of low dielectric constant materials